Consumer Electronics Industry Solutions
Focusing on miniaturized, high-performance PCB solutions, we combine HDI technology with rapid prototyping to meet the demands of smartphones, wearable devices, and more—while balancing cost optimization and rapid market responsiveness.
Proposal Introduction
Industrial control board
It adopts a heterogeneous architecture consisting of an FPGA and a DSP, with DDR4 and eMMC chips surface-mounted on the board. The board features an 18-layer design and a board thickness of 1.6 mm.
Key Control Points
● High-density board
● Multiple power rails
● Signal Integrity Design
● Thermal management
Keywords: Consumer Electronics Industry Solutions
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