PCB manufacturing-SCI

Technical Ability

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Category	Project	Processing capacity
Standard rigid multilayer board	Number of layers	2nd to 48th floors
	Finished board thickness	0.1-6.35mm
	Maximum copper thickness	Inner layer: 6 oz, outer layer: 10 oz
	Through-hole plate thickness-to-diameter ratio	20:1
High-frequency, high-speed board	Material type	PTFE + ceramic + fiberglass, hydrocarbon composite, PPO/PPE, modified epoxy
High-frequency, high-speed board	High line width and line spacing accuracy	±0.015 mm
Flexible-rigid PCB	Stacked structure	Single-layer and multi-layer flexible board symmetrical structures; asymmetrical structures in the vertical and horizontal directions; primary and secondary board structures.
	Minimum core board thickness for flexible boards	12.5 μm (excluding copper)
	Minimum dispensing width	1.5mm
	Strengthen positional tolerance	±0.05 mm
HDI board	Laminated stacking structure	6+N+6
	Maximum number of pressing cycles	7
	Minimum laser aperture/weld ring	70 μm / 25 μm
IC substrate	Minimum line width/line spacing	25μm/25μm
Mini-LED	Minimum line width/line spacing	35μm/35μm
	Thickness difference of the board	±5%
	LED bead PITCH spacing	P0.6mm
Common material brands	FR4 Materials: A full range from Shengyi, Lianmao, Nanya, Jiantao, Huazheng, and others. High-frequency materials: A full range including Rogers, Arlon, AGC, Wangling, Ruilong, Guoneng, and Institute 46. High-speed materials: the full range from Shengyi, Panasonic, Taiyo, Lianmao, Taiguang, and others. Flexible board materials: Shengyi, Lianmao, Panasonic, DuPont, Doosan, Xinyang, Taihong, and Xin Gao—entire product lines. Carrier board materials: a full range including Shengyi, Doosan, Mitsubishi Gas, and more.
Surface treatment	OSP, Lead-Containing/Lead-Free Tin Plating, Immersion Nickel-Gold/Nickel-Palladium-Gold, Electroplated Gold (Hard Gold or Soft Gold), Immersion Silver, Immersion Tin, Electroplated Gold + Chemically Plated Gold, Chemically Plated Gold + OSP
Special process	Step grooves, depth-controlled grooves, back-drilling, buried resistors, buried capacitors, copper inserts, blind buried vias, half-vias, resin-plugged holes, metal edge wrapping

Manufacturing Capacity

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A1

Sample factory

Core products: Samples, small-batch and other high-precision multilayer boards ≤ 20㎡.

A2

Batch factory

Core products: High-precision multilayer boards with batch sizes exceeding 20㎡, including servers and automotive boards.

A3

Carrier board factory

Core Products: IC substrates, high-end HDI boards, optical module boards, Mini-LED (IMD & COB), Micro-LED

A4

Specialty Plate Factory

Core products: high-frequency microwave boards, high-frequency and high-speed boards, rigid-flex boards, special materials with thick copper and high thermal conductivity, and specialized-process circuit boards.