Electronic Assembly
Electronic Assembly
Electronic assembly
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DFM Engineering Services

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DFM Engineering Services

E-BOM Engineering Design

Component Verification and Reliability Testing

  • Active components—ICs, Diodes/LEDs, MOSFETs
  • Passive Components—Crystal, Capacitor, Transformer, PCB
  • Module types - Adapter, Power, Battery, LCM, Fan, Microphone
  • Institutional/Hardware – Screw, Heat Sink Metal
  • Packaging materials – Carton, EPE, PE

BOM Risk Assessment

  • High-risk component screening
  • 2ndSource matchmaking
  • Functional comparison

P-BOM Process Manufacturing Design

Verification and Testing Items

  • Conformity inspection of appearance, screen printing, dimensions, etc.
  • Visual inspection, lid opening, X-ray inspection, and other tests
  • Component Second Screening

Other services

  • Cost optimization
  • Kit Assembly Cycle Management
  • Material inspection/verification on behalf of others
  • REACH, RoHS, and Exemption Investigations

M-BOM manufacturing

BOM DFP Procurement-Optimized Design

  • Early detection of missing BOM design options reduces the cost of repeated prototype production.