Electronic Circuit Design Case Studies-SCI

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Industrial control board

It adopts a heterogeneous architecture consisting of an FPGA and a DSP, with DDR4 and eMMC chips surface-mounted on the board. The board features an 18-layer design and has a board thickness of 1.6 mm.

Key control points

● High-density board

● Multiple power rails

● Signal Integrity Design

● Thermal management

Accelerated Cloud Expansion Card

Acceleration cloud expansion card based on Xilinx UltraScale FPGA and SFP+.

Key control points

● Signal timing control and impedance matching

● Anti-interference and Durability Design

High-speed data acquisition control board

A multi-channel high-speed data acquisition system is implemented using Xilinx XFPGA, ADI ADC, and ADI DAC. The design features a 12-layer PCB with a board thickness of 1.6 mm.

Key control points

● Signal Integrity Design

● Thermal management

Phytium core board

Equipped with a Phytium D2000 8-core high-performance processor, paired with the X100 chipset, and featuring onboard DDR4 and eMMC chips; it provides interfaces including USB 2.0, Gigabit Ethernet, USB 3.0, VGA, HDMI, DP, and PCIe 3.0.

Key control points

● Equal-length control for DDR4 wiring

● Multi-channel power rail management

● HDMI differential pair length matching control

● Thermal management