Product mounting-SCI

Manufacturing Capacity

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Digital management system with full-process quality traceability

Project			Conventional process	Non-conventional process	Note
SMT process	PCB	Minimum size	L≥50mm W≥50mm	L < 50 mm W < 50 mm	The minimum pin spacing for FPC-type PCBs is ≥0.4mm.
		Maximum size	L ≤ 450 mm W ≤ 400 mm	L ≤ 800 mm W ≤ 450 mm
		Thickness (T)	0.5 mm ≤ T ≤ 3 mm	T < 0.5 mm T > 3 mm
	Device size	Smallest package	0201 (0.6mm*0.3mm)	01005 (0.3mm * 0.2mm)	The height of double-sided process devices ≤ 25 mm.
		Maximum size	SMD ≤ 200mm × 125mm	SMD > 200mm * 125mm
		Device thickness	T ≤ 15 mm	T > 15 mm
	QFP, SOP, SOJ, etc.	Minimum PIN spacing	0.35mm	0.3 mm ≤ Pitch < 0.35 mm
	CSP, BGA	Minimum ball spacing	0.35mm	0.3 mm ≤ Pitch < 0.4 mm
DIP process (Reflow Soldering)	PCB size	Minimum size	L≥50mm W≥50mm	L < 50 mm	BOT surface component <9mm The distance between the pin of the plug-in component and the SMT part on the BOT side shall be greater than the thickness of the SMT part plus 1.0 mm.
		Maximum size	L ≤ 500 mm W ≤ 400 mm	L < 800 mm W ≤ 400 mm
		Thinnest dimension	T ≥ 0.5 mm	T < 0.5 mm
		Maximum thickness	T ≤ 5 mm	T > 5 mm
Three-proof coating process	Process parameters	Temperature resistance range	-40℃ ≤ T ≤ 120℃	-50℃ ≤ T ≤ 150℃	The three-proof unconventional process involves manual brushing.
Three-proof coating process	Process parameters	Coating thickness	25 µm ≤ T ≤ 50 µm	T > 50 µm
Flying needle test Process	Device height	Upper side	H ≤ 60 mm	H > 60 mm	Product Static Circuit Detection
	Device height	Lower side	H ≤ 120 mm	H > 120 mm
	PCB thickness	Thickness	T ≤ 5 mm	T > 5 mm