Product Mounting

Mounting and Manufacturing Capabilities

Manufacturing Capacity

Digital management system with full-process quality traceability

Project			Conventional process	Non-conventional process	Note
SMT process	PCB	Minimum size	L≥50mm W≥50mm	L < 50 mm W < 50 mm	The minimum pin spacing for FPC-type PCBs is ≥0.4mm.
		Maximum size	L ≤ 450 mm W ≤ 400 mm	L ≤ 800 mm W ≤ 450 mm
		Thickness (T)	0.5 mm ≤ T ≤ 3 mm	T < 0.5 mm T > 3 mm
	Device size	Smallest package	0201 (0.6mm*0.3mm)	01005 (0.3mm * 0.2mm)	The height of double-sided process devices ≤ 25 mm.
		Maximum size	SMD ≤ 200mm × 125mm	SMD > 200mm * 125mm
		Device thickness	T ≤ 15 mm	T > 15 mm
	QFP, SOP, SOJ, etc.	Minimum PIN spacing	0.35mm	0.3 mm ≤ Pitch < 0.35 mm
	CSP, BGA	Minimum ball spacing	0.35mm	0.3 mm ≤ Pitch < 0.4 mm
DIP process (Reflow Soldering)	PCB size	Minimum size	L≥50mm W≥50mm	L < 50 mm	BOT surface component <9mm The distance between the pin of the plug-in component and the SMT part on the BOT side shall be greater than the thickness of the SMT part plus 1.0 mm.
		Maximum size	L ≤ 500 mm W ≤ 400 mm	L < 800 mm W ≤ 400 mm
		Thinnest dimension	T ≥ 0.5 mm	T < 0.5 mm
		Maximum thickness	T ≤ 5 mm	T > 5 mm
Three-proof coating process	Process parameters	Temperature resistance range	-40℃ ≤ T ≤ 120℃	-50℃ ≤ T ≤ 150℃	The three-proof unconventional process involves manual brushing.
Three-proof coating process	Process parameters	Coating thickness	25 µm ≤ T ≤ 50 µm	T > 50 µm
Flying needle test Process	Device height	Upper side	H ≤ 60 mm	H > 60 mm	Product Static Circuit Detection
	Device height	Lower side	H ≤ 120 mm	H > 120 mm
	PCB thickness	Thickness	T ≤ 5 mm	T > 5 mm

Production equipment

Production Equipment

High-precision, cutting-edge manufacturing equipment, both domestically and internationally; small-pitch 0.35 pitch BGA/QFN.

Board separator

Selective Coating Machine

External Spray Nitrogen Wave Soldering

GT++ Fully Automatic Solder Paste Printer

3D SPI solder paste inspection machine

Panasonic NPM Pick-and-Place Machine

Import from domestic and international sources
High-precision and advanced
Manufacturing equipment

Small pitch
0.35 pitch
BGA/QFN

Digital Management System

Quality assurance

Quality Assurance

Twelve-step testing process

Twelve Inspection Processes

IQC incoming material inspection

IPQC Line Inspection

Steel mesh tension detection

FAI First Article Inspection

X-ray inspection

3D-AOI Optical Inspection (SMT)

DIP Plug-in AOI Optical Inspection

ICT Testing (Optional)

FCT Functional Testing

FQC manual inspection

OQC Shipment Inspection

3D-SPI solder paste inspection

Delivery Management

24/7 rapid response, fast delivery.

Technical support

Order Service

Production Operations

Home delivery

12H

500-1000 small to medium quantities

24H

100-500 small batches

48H

500-1000 small to medium quantities

72H

1K-5K batch

48H

>5K large batch

Delivery Management

Pull-based planning—“Push and pull” to build a “highway” from order placement to product shipment.

Customer-centric

快速服务

The CFT multi-functional team responds to customer needs around the clock; it also holds regular production-and-sales coordination meetings to collaboratively address challenges encountered in market sales.

前置治工具制作计划

物料烘烤纳入生产计划

The material baking time is linked to the warehouse material issuance module, enabling proactive material issuance based on planned demand and reducing the turnaround time for handling online anomalies.

日生产“六步法”

Daily Plan: The production plan is detailed down to the smallest unit, with clearly defined task objectives. Daily Improvement: Focus on addressing bottlenecks and resolving production abnormalities. Daily Material Preparation: Conduct pre-production checks and preparations based on the plan. Daily Inspection: Perform frequent inspections every 2 hours. Daily Coordination: Hold production coordination meetings and order-specific meetings. Daily Assessment: Evaluate the achievement of the daily plan and performance metrics.

缩短物料齐套周期

Establish a material control position, proactively communicate with customers in a timely manner about any abnormalities in customer-supplied materials, provide on-site support to customers regarding order preparation and damage prevention standards as well as material loss management, and reduce cycle times associated with intermediate sales handoffs.

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About Xingchuang Zhilian

Product Solution

Electronic circuit design

PCB manufacturing

Electronic Assembly